MISTRINI, ANDREA
 Distribuzione geografica
Continente #
AS - Asia 138
EU - Europa 131
NA - Nord America 103
SA - Sud America 15
AF - Africa 5
OC - Oceania 1
Totale 393
Nazione #
US - Stati Uniti d'America 101
IT - Italia 58
CN - Cina 53
RU - Federazione Russa 37
SG - Singapore 35
BR - Brasile 14
VN - Vietnam 14
JP - Giappone 13
KR - Corea 13
GB - Regno Unito 8
CH - Svizzera 7
MA - Marocco 5
DE - Germania 4
ES - Italia 4
NL - Olanda 4
AT - Austria 3
FR - Francia 3
HK - Hong Kong 2
IN - India 2
IQ - Iraq 2
PK - Pakistan 2
AL - Albania 1
AR - Argentina 1
AU - Australia 1
BE - Belgio 1
CA - Canada 1
ID - Indonesia 1
IR - Iran 1
PL - Polonia 1
SV - El Salvador 1
Totale 393
Città #
Milan 27
Singapore 24
San Jose 23
Dallas 21
Seoul 13
Tokyo 13
Hefei 12
Ashburn 9
Rome 7
Hanoi 6
Turin 5
London 4
Poplar 4
Atlanta 3
Campinas 3
Council Bluffs 3
Kenitra 3
Kent 3
Lauterbourg 3
Los Angeles 3
North Charleston 3
Orem 3
Qingdao 3
Vienna 3
Amsterdam 2
Casablanca 2
Denver 2
Florence 2
Ho Chi Minh City 2
Hong Kong 2
Mira 2
New York 2
Seattle 2
The Dalles 2
Zurich 2
Auburn 1
Baoding 1
Bauru 1
Beijing 1
Belo Horizonte 1
Biel/Bienne 1
Bruneck 1
Brussels 1
Buffalo 1
Changsha 1
Chicago 1
Coimbatore 1
Curno 1
Da Nang 1
Dalton 1
Düsseldorf 1
Eagleville 1
Enschede 1
Fuzhou 1
Guangzhou 1
Haiphong 1
Houston 1
Hải Dương 1
Ipaussu 1
Isfahan 1
Jaú 1
Jundiaí 1
Las Vegas 1
Mairi 1
Marabá 1
Melbourne 1
Moscow 1
Muggiò 1
Nanchang 1
Nanjing 1
Nanyang 1
Naples 1
Nossa Senhora da Glória 1
Paracatu 1
Phoenix 1
Rio Grande da Serra 1
Salt Lake City 1
San Miguel 1
San Salvador 1
Santa Clara 1
Shenyang 1
Shijiazhuang 1
São Paulo 1
Thành Phố Phủ Lý 1
Tirana 1
Warsaw 1
thị xã Quảng Trị 1
Totale 275
Nome #
DESIGN AND DEVELOPMENT OF ALLOYS AND COMPOSITES WITH IMPROVED ADDITIVE MANUFACTURING PROCESSABILITY, FUNCTIONAL PROPERTIES, AND MECHANICAL PERFORMANCE 187
Microstructure and tensile properties of TIB2-reinforced Al-2618 thin walls produced by laser powder bed fusion 89
LPBF of Sn-Ag Thermal Interfaces on Si substrate for High-Performance Electronic Cooling 68
Wafer-scale PBF-LB/M additive manufacturing of SnAg3 as thermal interface materials for advanced high-power electronics cooling 29
Laser Powder Bed Fusion of Multi-Material Heat Sink on Silicon Substrate: A Sn-Al Solution for High-Power Electronic Heat Dissipation 13
Pool Boiling Heat Transfer on Directly 3D-Printed Metallic Micropillars on Silicon Chips 13
Totale 399
Categoria #
all - tutte 679
article - articoli 202
book - libri 0
conference - conferenze 477
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 1.358


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2024/202561 0 0 0 0 0 0 0 11 13 20 10 7
2025/2026338 20 38 43 43 31 20 38 13 46 46 0 0
Totale 399