LPBF of Sn-Ag Thermal Interfaces on Si substrate for High-Performance Electronic Cooling

The continuous miniaturization of electronic components and the increasing power density in microprocessors require advanced thermal management solutions. In this study, we explore the use of Laser Powder Bed Fusion (LPBF) for fabricating Sn-Ag solder alloy as a thermal interface material (TIM) directly onto silicon wafers. By fine-tuning LPBF parameters, we demonstrate control over the microstructure and composition of the additively manufactured TIM, crucial for optimizing thermal conductivity and mechanical reliability. Our results highlight the potential of LPBF Sn-Ag layers as a high-performance alternative to conventional TIMs in high-power electronics, offering improved thermal dissipation and reliability. Key processing parameters, microstructural characteristics and their correlation with thermal performance are discussed in detail.