A new experimental technique for investigating the trapping-detrapping time constants for electrons at stress-induced defects in the silicon oxide is presented. The new technique is based on the gate-stress measurement for flash memories, with the application of a pulsed gate voltage. Data for 512 Kbit NOR-flash arrays are presented, and analyzed by analytical and Monte Carlo models for the trap-assisted tunneling mechanism under pulsed conditions. Comparison between experimental data and calculations for selected cells allows for an estimation of the energy and spatial depth of the oxide traps

A new charge-trapping technique to extract SILC-trap time constants in SiO2

IELMINI, DANIELE;SOTTOCORNOLA SPINELLI, ALESSANDRO;LACAITA, ANDREA LEONARDO;
2005-01-01

Abstract

A new experimental technique for investigating the trapping-detrapping time constants for electrons at stress-induced defects in the silicon oxide is presented. The new technique is based on the gate-stress measurement for flash memories, with the application of a pulsed gate voltage. Data for 512 Kbit NOR-flash arrays are presented, and analyzed by analytical and Monte Carlo models for the trap-assisted tunneling mechanism under pulsed conditions. Comparison between experimental data and calculations for selected cells allows for an estimation of the energy and spatial depth of the oxide traps
2005
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
0-7803-9268-X
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/263558
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