This paper discusses the advantages offered by a circuit-based approach in performing electrothermal simulations of multicellular power MOSFETs. It is shown that the I-V characteristics and the bias-dependent average temperature in the power dissipation region(s) can be determined with high accuracy in a negligible CPU time. It is also found that the results are almost insensitive to the choice of the heat source(s) model under steady-state conditions.

Investigation of the Compact Thermal Modeling of SiC-Based Power MOSFETs

Codecasa, Lorenzo;
2025-01-01

Abstract

This paper discusses the advantages offered by a circuit-based approach in performing electrothermal simulations of multicellular power MOSFETs. It is shown that the I-V characteristics and the bias-dependent average temperature in the power dissipation region(s) can be determined with high accuracy in a negligible CPU time. It is also found that the results are almost insensitive to the choice of the heat source(s) model under steady-state conditions.
2025
31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025 - Proceedings
Electrothermal (ET) simulation
finite-element method (FEM)
heat source (HS)
power MOSFET
silicon carbide
thermal resistance
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/1309388
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