3D-Printable Polymer Composites With Unmodified Boron Nitride for Thermal Management in Flexible Electronics

Flexible high-performance electronics are facing the challenge of managing increasing thermal loads in the latest devices. This study presents a one-step method for 3D printing flexible boron nitride (BN) polymer composites via vat photopolymerization, enhancing thermal conductivity by 270% to 0.8 W m-1 K-1 and improving dielectric properties (17% lower permittivity and 18% reduced dielectric loss). Unmodified h-BN microplatelets are integrated in a UV-curable polymer matrix, simplifying the manufacturing compared to functionalized or hybrid filler systems. Composites with 20 wt% BN achieve feature resolutions of 125 mu m with excellent dimensional fidelity, while mechanical properties show an increase in tensile strength of 215% and retain flexibility. The thermal performance of the 3D-printed structures is assessed using IR thermography under simulated operational conditions, confirming enhanced heat transfer in the BN-filled structures. Overall, this research presents a practical me...