Guest Editorial Special Section on Advances in Modeling and Characterization for Electronics Cooling

Thermal management of electronic devices and systems remains an active research domain, which is increasingly characterized by strong multidisciplinary collaborations, often involving both academic and industry researchers. The growing thermal and reliability demands, increased power density, and an evolving variety of platform and device types are all driving factors behind trends for enhanced co-design of devices involving combinations of electronic, electrical, mechanical, acoustics, and material aspects.