Advancing in the analysis of materials in electr(on)ic equipment

Despite there is a great effort to support strategies for a circular economy of electr(on)ics as maintenance, repair, remanufacture and reuse, recycling keeps being the final ultimate stage reached by them. As the supply of materials has become a key issue for the economic and technology development, more information about the content of materials in electr(on)ics is in order. This is especially for printed circuit boards contained in the majority of electr(on)ics which have a great variety of materials with a significant economic value. This paper discusses two methodologies to quantify the material composition of these parts. The first methodology quantifies the material content using two algorithms to identify the typologies of electr(on)ics components, and the average material composition of some typologies of electr(on)ic components given by original manufacturers. The second methodology uses the Database of SEmiconductors (DoSE) which contains the full material composition of about 250 different electr(on)ic components of printed circuit boards. A case study based on the analysis of two models of battery management systems contained in the batteries of electric vehicles is developed to compare the material composition results obtained from the two methodologies. Although the analysis is limited to some electr(on)ic components, mainly the integrated circuit and capacitors, the results of the composition of the battery management system are given for a list of materials including aluminum, copper, iron, gold, lead, nickel and tantalum. For two of the most economically relevant materials, copper and gold, the results obtained by the two methodologies differ 2% for copper and 4% for gold. To advance towards more automatized and systematic methodologies to estimate the material composition of the battery management systems, there are some further developments needed: to increase datasets for other electr(on)ic components as connectors, and better quantification of the number of layers and finishing of the circuit boards as they are made of significant quantities of copper and gold.