In this paper, an extension of the existing Thermal Resistance and Impedance Calculator (TRIC) tool is proposed, which allows an efficient, yet accurate, computation of thermomechanical stress under stationary conditions in any specimen of a family of electronic packages. Each thermo-mechanical model is automatically generated and quickly solved by using a multigrid iteration solver and an ad hoc projection-based approach. An exposed quad-flat package is investigated as a case-study.

Towards the Extension of TRIC for Thermo-Mechanical Analysis

Codecasa L.;
2021-01-01

Abstract

In this paper, an extension of the existing Thermal Resistance and Impedance Calculator (TRIC) tool is proposed, which allows an efficient, yet accurate, computation of thermomechanical stress under stationary conditions in any specimen of a family of electronic packages. Each thermo-mechanical model is automatically generated and quickly solved by using a multigrid iteration solver and an ad hoc projection-based approach. An exposed quad-flat package is investigated as a case-study.
2021
2021 27th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2021
978-1-6654-1896-6
Package
stress
thermo-mechanical simulation
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/1204049
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