Low-frequency and wide bandgap vibration-insulating module device and relative periodic structure

The present invention relates to a vibration-insulating module device (100; 200; 300; 400; 500) comprising: six mass elements (101; 201; 301; 401; 01) respectively adjacent and directly not joined with each other; at least three stiffness elements (102; 202; 302; 402; 502) interconnected with each other; six mass elements (101; 201; 301; 401; 501) comprising respective at least six anchor elements (103; 203; 303; 403; 503), each of the anchor elements (103; 203; 303; 403; 503) being configured for mechanically connecting each one of said mass elements(101; 201; 301; 401; 501) with respective portions of two of the stiffness elements(102; 202; 302; 402; 02). The present invention further relates to a vibration-insulating periodic structure (600).