This paper presents an extensive analysis aimed at quantifying the impact of all the key layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs. The investigation is conducted by resorting to accurate 3-D numerical simulations performed in accordance to the Design Of Experiments technique.
Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs
Codecasa, L.;
2017-01-01
Abstract
This paper presents an extensive analysis aimed at quantifying the impact of all the key layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs. The investigation is conducted by resorting to accurate 3-D numerical simulations performed in accordance to the Design Of Experiments technique.File in questo prodotto:
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