A novel approach for constructing multi-port dynamic compact thermal models of nonlinear heat diffusion in electronic components is presented, extending a technique previously conceived for the one-port case. The approach allows achieving high levels of accuracy even for small state-space dimensions of the model. It is also very efficient since it requires the solutions to a few linear heat diffusion problems in the frequency domain. The multi-port compact models exhibit structure similar to the one-port counterparts and can be used to accurately approximate not only the junction temperatures, but also the whole space-time temperature distribution within the electronic components.

Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction

CODECASA, LORENZO;
2015-01-01

Abstract

A novel approach for constructing multi-port dynamic compact thermal models of nonlinear heat diffusion in electronic components is presented, extending a technique previously conceived for the one-port case. The approach allows achieving high levels of accuracy even for small state-space dimensions of the model. It is also very efficient since it requires the solutions to a few linear heat diffusion problems in the frequency domain. The multi-port compact models exhibit structure similar to the one-port counterparts and can be used to accurately approximate not only the junction temperatures, but also the whole space-time temperature distribution within the electronic components.
2015
Dynamic compact thermal model (DCTM); Nonlinear model order reduction; Nonlinear thermal analysis; Electronic, Optical and Magnetic Materials; Atomic and Molecular Physics, and Optics; Condensed Matter Physics; Surfaces, Coatings and Films; Electrical and Electronic Engineering
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/1027631
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