LI, DONGWEI
 Distribuzione geografica
Continente #
NA - Nord America 470
EU - Europa 113
AS - Asia 69
Totale 652
Nazione #
US - Stati Uniti d'America 463
SG - Singapore 32
AT - Austria 24
IT - Italia 19
FI - Finlandia 15
VN - Vietnam 14
CN - Cina 13
DE - Germania 12
UA - Ucraina 12
GB - Regno Unito 9
CA - Canada 7
ES - Italia 7
JO - Giordania 7
FR - Francia 5
IE - Irlanda 4
BE - Belgio 3
NL - Olanda 3
IN - India 2
JP - Giappone 1
Totale 652
Città #
Fairfield 76
Chandler 44
Houston 43
Woodbridge 43
Santa Clara 27
Singapore 27
Wilmington 27
Ashburn 26
Seattle 26
Vienna 24
Cambridge 23
Ann Arbor 22
Milan 12
Jacksonville 11
Boardman 9
Helsinki 9
Dong Ket 8
Amman 7
Lawrence 7
Medford 7
Málaga 7
Dearborn 6
Ottawa 6
Columbus 5
San Diego 5
Xian 5
Dublin 4
Amsterdam 3
Brussels 3
Falls Church 3
Beijing 2
Des Moines 2
Falkenstein 2
London 2
Mountain View 2
Nanjing 2
Norwalk 2
Atlanta 1
Hefei 1
Longueuil 1
New Bedfont 1
Totale 543
Nome #
Boundary element computation of line parameters of on-chip interconnects on lossy silicon substrate 108
Boundary element computation of line parameters of on-chip interconnects on lossy silicon substrate 107
Array of rectilinear solenoids for rail current measurement 104
Current measurement in the time-domain based on the inversion of magnetic field data 96
Robustness analysis of magnetic sensor arrays for current sensing 94
Modeling arrays of rectilinear solenoids for current sensing 79
Isogeometric finite elements with surface impedance boundary conditions 70
Totale 658
Categoria #
all - tutte 2.131
article - articoli 974
book - libri 0
conference - conferenze 1.157
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 4.262


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202091 0 0 0 0 0 0 19 15 19 12 21 5
2020/202179 7 5 3 6 4 16 4 8 3 6 3 14
2021/202258 2 7 7 1 3 1 7 4 6 3 7 10
2022/202390 10 11 4 6 13 12 1 6 14 9 4 0
2023/202435 8 8 5 5 1 5 0 0 0 0 0 3
2024/202568 2 16 5 3 30 11 1 0 0 0 0 0
Totale 658