LI, DONGWEI
 Distribuzione geografica
Continente #
NA - Nord America 435
EU - Europa 111
AS - Asia 56
Totale 602
Nazione #
US - Stati Uniti d'America 428
AT - Austria 24
IT - Italia 19
SG - Singapore 19
FI - Finlandia 15
VN - Vietnam 14
CN - Cina 13
UA - Ucraina 12
DE - Germania 10
GB - Regno Unito 9
CA - Canada 7
ES - Italia 7
JO - Giordania 7
FR - Francia 5
IE - Irlanda 4
BE - Belgio 3
NL - Olanda 3
IN - India 2
JP - Giappone 1
Totale 602
Città #
Fairfield 76
Chandler 44
Houston 43
Woodbridge 43
Wilmington 27
Ashburn 26
Seattle 26
Vienna 24
Cambridge 23
Ann Arbor 22
Singapore 17
Milan 12
Jacksonville 11
Helsinki 9
Dong Ket 8
Amman 7
Lawrence 7
Medford 7
Málaga 7
Dearborn 6
Ottawa 6
Columbus 5
San Diego 5
Xian 5
Dublin 4
Amsterdam 3
Brussels 3
Falls Church 3
Beijing 2
Boardman 2
Des Moines 2
London 2
Mountain View 2
Nanjing 2
Norwalk 2
Atlanta 1
Hefei 1
Longueuil 1
New Bedfont 1
Totale 497
Nome #
Boundary element computation of line parameters of on-chip interconnects on lossy silicon substrate 101
Array of rectilinear solenoids for rail current measurement 98
Boundary element computation of line parameters of on-chip interconnects on lossy silicon substrate 98
Current measurement in the time-domain based on the inversion of magnetic field data 90
Robustness analysis of magnetic sensor arrays for current sensing 85
Modeling arrays of rectilinear solenoids for current sensing 72
Isogeometric finite elements with surface impedance boundary conditions 64
Totale 608
Categoria #
all - tutte 1.915
article - articoli 878
book - libri 0
conference - conferenze 1.037
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 3.830


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/2020150 0 0 3 14 23 19 19 15 19 12 21 5
2020/202179 7 5 3 6 4 16 4 8 3 6 3 14
2021/202258 2 7 7 1 3 1 7 4 6 3 7 10
2022/202390 10 11 4 6 13 12 1 6 14 9 4 0
2023/202435 8 8 5 5 1 5 0 0 0 0 0 3
2024/202518 2 16 0 0 0 0 0 0 0 0 0 0
Totale 608