Due to the increasing demand of miniaturization of MEMS devices, the characteristic size (e.g. the width) of some mechanical components may become comparable to that of a silicon grain. Therefore, the relevant effective mechanical properties can vary significantly from one device to another. In this work, through on-chip tests we investigate the behavior of polysilicon films using standard electrostatic actuation/sensing. The outcomes of the experimental campaign are then compared to those obtained with an analytical reduced-order model of the moving structure, and to coupled electro-mechanical simulations accounting for the polycrystalline morphology of the silicon film. These two models are adopted to bilaterally bound the experimental data up to pull-in, and to assess the scattering induced by the random orientation of the crystal lattice of each grain in slender parts of the devices.

Assessment of overetch and polysilicon film properties through on-chip tests

MIRZAZADEH, RAMIN;GHISI, ALDO FRANCESCO;MARIANI, STEFANO
2015

Abstract

Due to the increasing demand of miniaturization of MEMS devices, the characteristic size (e.g. the width) of some mechanical components may become comparable to that of a silicon grain. Therefore, the relevant effective mechanical properties can vary significantly from one device to another. In this work, through on-chip tests we investigate the behavior of polysilicon films using standard electrostatic actuation/sensing. The outcomes of the experimental campaign are then compared to those obtained with an analytical reduced-order model of the moving structure, and to coupled electro-mechanical simulations accounting for the polycrystalline morphology of the silicon film. These two models are adopted to bilaterally bound the experimental data up to pull-in, and to assess the scattering induced by the random orientation of the crystal lattice of each grain in slender parts of the devices.
Proceedings of the 2nd International Electronic Conference on Sensors and Applications
978-3-03842-225-9
polysilicon film; morphology uncertainties; coupled electro-mechanical simulations; reduced order model
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11311/978652
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