In this work we present a numerical, multi-scale approach to estimate the strength of a wafer-to-wafer metallic thermo-compression bonding. Following a top-down approach, the mechanical problem is handled at three different length scales. Taking into account control variables such as temperature, overall applied force over the wafer and contact surface roughness, it is shown that the proposed approach is able to provide an estimate of the sealing properties, especially in terms of bonding strength

A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging.

GHISI, ALDO FRANCESCO;MARIANI, STEFANO;CORIGLIANO, ALBERTO;
2014

Abstract

In this work we present a numerical, multi-scale approach to estimate the strength of a wafer-to-wafer metallic thermo-compression bonding. Following a top-down approach, the mechanical problem is handled at three different length scales. Taking into account control variables such as temperature, overall applied force over the wafer and contact surface roughness, it is shown that the proposed approach is able to provide an estimate of the sealing properties, especially in terms of bonding strength
Metallic bonding; multi-scale approach; surface roughness
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11311/871174
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