We report on organic field-effect transistors (OFETs) with sub-micrometer channels fabricated on plastic substrates with fully direct-written electrical contacts. In order to pattern source and drain electrodes with high resolution and reliability, we adopted a combination of two digital, direct writing techniques: ink-jet printing and femtosecond laser ablation. First silver lines are deposited by inkjet printing and sintered at low temperature and then sub-micrometer channels are produced by highly selective femtosecond laser ablation, strongly improving the lateral patterning resolution achievable with inkjet printing only. These direct-written electrodes are adopted in top gate OFETs, based on high-mobility holes and electrons transporting semiconductors, with field-effect mobilities up to 0.2 cm2/V s. Arrays of tens of devices have been fabricated with high process yield and good uniformity, demonstrating the robustness of the proposed direct-writing approach for the patterning of downscaled electrodes for high performance OFETs, compatibly with cost-effective manufacturing of large-area circuits.
High-resolution direct-writing of metallic electrodes on flexible substrates for high performance organic field effect transistors
BUCELLA, SADIR GABRIELE;NAVA, GIORGIO;
2013-01-01
Abstract
We report on organic field-effect transistors (OFETs) with sub-micrometer channels fabricated on plastic substrates with fully direct-written electrical contacts. In order to pattern source and drain electrodes with high resolution and reliability, we adopted a combination of two digital, direct writing techniques: ink-jet printing and femtosecond laser ablation. First silver lines are deposited by inkjet printing and sintered at low temperature and then sub-micrometer channels are produced by highly selective femtosecond laser ablation, strongly improving the lateral patterning resolution achievable with inkjet printing only. These direct-written electrodes are adopted in top gate OFETs, based on high-mobility holes and electrons transporting semiconductors, with field-effect mobilities up to 0.2 cm2/V s. Arrays of tens of devices have been fabricated with high process yield and good uniformity, demonstrating the robustness of the proposed direct-writing approach for the patterning of downscaled electrodes for high performance OFETs, compatibly with cost-effective manufacturing of large-area circuits.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.