Creep Resistance Properties of a Phosphorus-Doped/Oxygen-Free Copper-Silver Alloy: Experimental Results and Empirical Model Application

The purpose of this work is the study of creep behavior for a phosphorus-doped oxygen-free copper-silver alloy at low temperatures. Experimental tests at different stress and temperature levels will be performed and analyzed in comparison with the equivalent failure tests for a pure ETP copper. The obtained creep curves will be fitted in an empirical model based on the continuum damage mechanics so as to determine material constants with the aim to predict new curves at different stress conditions and analyze the rupture strain and time data without the need of additional experimental results. Strain ratio determined during experimental tests has been also proven by a physical model which considers the interested deformation mechanism.