Electrodeposition of Ni/Cu multilayer nanowires using alumina template

Nickel/copper multilayer nanowires have been electrodeposited in sulphamate electrolytes containing nickel and copper ions by alternating potential pulses using alumina template. In order to compare the wires and bulk behavior, nano-thick Ni/Cu multilayers bulk were electrodeposited on sputtered gold silicon under the same conditions. The optimal deposition potential range for nickel was between -1.2 and -1.25 V vs. a saturated calomel electrode (SCE) to minimize the copper content and to prevent formation of nickel hydroxide and nickel hydride. The optimal deposition potential range for copper was between -0.4 and -0.8 V vs. SCE. Magnetic properties of Ni/Cu multilayers were determined at various Ni and Cu layer spacing.