The purpose of this research is to study the adhesion phenomena in poly-silicon Micro-Electro-Mechanical Systems (MEMS) by means of experimental characterization and numerical simulation. In the experimental part, the adhesion energy is measured on-chip by means of on-purpose designed and fabricated devices; moreover, the surface roughness is characterized through the atomic force microscope. For the numerical part, a specific method has been developed in order to simulate the process of adhesion

Adhesion energy in silicon MEMS: comparison of experiments and simulations

ARDITO, RAFFAELE;CORIGLIANO, ALBERTO;FRANGI, ATTILIO ALBERTO;MAGAGNIN, LUCA
2011

Abstract

The purpose of this research is to study the adhesion phenomena in poly-silicon Micro-Electro-Mechanical Systems (MEMS) by means of experimental characterization and numerical simulation. In the experimental part, the adhesion energy is measured on-chip by means of on-purpose designed and fabricated devices; moreover, the surface roughness is characterized through the atomic force microscope. For the numerical part, a specific method has been developed in order to simulate the process of adhesion
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11311/615139
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