Effect of organic additives on copper dissolution for e-CMP

Among the planarization methods, electrochemical chemical mechanical polishing (e-CMP) is recognized as the most eligible for future applications in the electronic industry. The introduction of porous low-k dielectric materials into semiconductor devices requires the development of low downforce Cu e-CMP. It is well-known that inhibitors play a key-role in the e-CMP process. In this study, the effect of different additive (like as benzotriazole (BTA) and 5-phenyl-1H-tetrazole (PTA)) on e-CMP of copper was investigated.