Solid damping in Micro Electro Mechanical Systems

This paper focuses on the problem of the numerical evaluation of dissipation induced by thermoelastic coupling in microelectromechanical systems. An ad hoc conceived, FE based, numerical procedure for the evaluation of the thermoelastic dissipation is proposed and the numerical results are compared with analytical solutions. In order to introduce in the numerical response a dependence on the size of the resonating devices, which is experimentally observed at very small dimensions, a new enhanced non-local coupled thermoelastic model is proposed and the first results are discussed.