In-situ monitoring and inspection have been widely recognized as critical enabling technologies for the industrial adoption of additive manufacturing (AM). Among available sensing methods, thermal video imaging plays a central role as it provides spatially resolved information on thermal gradients and hot ejecta that are closely linked to defect formation mechanisms. However, high-speed thermal imaging entails complex equipment, resulting in a scarcity of publicly available datasets. To address this gap, we present a dataset comprising high-speed thermal video recordings acquired during laser powder bed fusion of copper components. A distinctive feature of the underlying study is the use of multi-material substrates, consisting of copper and ceramic layers commonly used in power electronic devices, which introduce challenging heat dissipation conditions and amplify the relevance of thermal monitoring. The dataset can be used to support the development and test of machine learning and thermal modeling methods. It includes raw infrared videos alongside supplementary data designed to facilitate interpretation, reproducibility, and reuse.

In-situ high-speed thermal video data in Laser Powder Bed Fusion on copper-ceramic substrates

Bugatti, Matteo;Tsiamyrtzis, Panagiotis;Grasso, Marco;Colosimo, Bianca Maria
2026-01-01

Abstract

In-situ monitoring and inspection have been widely recognized as critical enabling technologies for the industrial adoption of additive manufacturing (AM). Among available sensing methods, thermal video imaging plays a central role as it provides spatially resolved information on thermal gradients and hot ejecta that are closely linked to defect formation mechanisms. However, high-speed thermal imaging entails complex equipment, resulting in a scarcity of publicly available datasets. To address this gap, we present a dataset comprising high-speed thermal video recordings acquired during laser powder bed fusion of copper components. A distinctive feature of the underlying study is the use of multi-material substrates, consisting of copper and ceramic layers commonly used in power electronic devices, which introduce challenging heat dissipation conditions and amplify the relevance of thermal monitoring. The dataset can be used to support the development and test of machine learning and thermal modeling methods. It includes raw infrared videos alongside supplementary data designed to facilitate interpretation, reproducibility, and reuse.
2026
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/1325211
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