A DC-DC converter is presented that combines dual-path power delivery with resonant capacitor soft charging and interleaved operation to achieve high power density in sub-1V portable power management. The chip, implemented in a 0.18μm BCD technology, is co-designed together with a PCB interposer, enabling vertical stacking of passive components while leveraging the PCB parasitic inductance to realize zerocurrent switching. The converter operates with a 4.0 -to- 5.0 V input voltage and delivers a current up to 7A at a voltage in the 0.6 -to- 1.2 V range, with 91.6% peak power efficiency and 0.5 W/mm2 peak power density.

A 0.5W/mm2-Power-Density, 91.6%-Peak-Efficiency, Resonant Dual-Path Interleaved DC-DC Converter

Zaffin, S.;Leoncini, M.;Bertolini, A.;Dago, A.;Gasparini, A.;Levantino, S.;Ghioni, M.
2026-01-01

Abstract

A DC-DC converter is presented that combines dual-path power delivery with resonant capacitor soft charging and interleaved operation to achieve high power density in sub-1V portable power management. The chip, implemented in a 0.18μm BCD technology, is co-designed together with a PCB interposer, enabling vertical stacking of passive components while leveraging the PCB parasitic inductance to realize zerocurrent switching. The converter operates with a 4.0 -to- 5.0 V input voltage and delivers a current up to 7A at a voltage in the 0.6 -to- 1.2 V range, with 91.6% peak power efficiency and 0.5 W/mm2 peak power density.
2026
2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/1320305
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