Thermal Adaptive Space Vector Modulation for Current Source Converters

The purpose of this paper is to propose a new active thermal modulation strategy for current source converters (CSCs) aimed at reducing the thermal stress on the converter semiconductors. Thermal cycling is a major contributor to fatigue, aging, and eventual failure of power electronics components. Implementing the proposed modulation scheme improves the reliability and lifetime expectancy of the CSC. The adopted solution exploits the redundancy of the zero states of the space vector modulation (SVM) strategy, actively adapting their selection in real time to limit junction temperature swings and peak values of power electronics components. The active thermal modulation concept is firstly explained. Then, its effectiveness is tested in comparison to classic SVM through simulations performed in Simulink/Simscape®. Finally, a finite elements thermal analysis is conducted using ANSYS Icepak® to confirm the results of the Simscape simulations.