Copper/Molding Compound Interfacial Delamination

Delamination at the resin-copper interface is fully investigated by adopting experimental and numerical techniques. Due to the heterogeneous nature of the molding compound, a complete microscopic assessment is necessary to understand its impact on macroscopic mechanical and adhesion properties. Starting from microstructure morphology, inverse homogenization scheme is employed to derive polymer elastic features from experimental data relevant to the resin. Fracture tests are adopted to describe the response of the interface between the two materials. Microstructural effects on adhesion are studied with micro-scale models of the copper-polymerfiller system, accounting for adhesion through a cohesive approach. The effects of filler content changes, substrate surface roughness, and intrinsic experimental adhesive parameters on the effective traction-separation law are successfully assessed. Finally, the promising findings are beneficial to analyze the interface damage propagation during package-oriented reliability tests and may be employed to investigate such interfaces in microelectronic plastic packages.