Delamination at the resin-copper interface is fully characterized during operative conditions by adopting a combined experimental and numerical approach. Peeling and four-point bending fracture tests are used along with cohesive zone models to reach this purpose. The promising findings are beneficial to analyze the crack propagation at the interface during package-oriented reliability tests, and may therefore be employed to enhance these interfaces in microelectronic plastic packages.
Adhesion Copper/Molding Compound: Modeling and Characterization
Samuele Zalaffi;Luca Andena;Stefano Mariani
2023-01-01
Abstract
Delamination at the resin-copper interface is fully characterized during operative conditions by adopting a combined experimental and numerical approach. Peeling and four-point bending fracture tests are used along with cohesive zone models to reach this purpose. The promising findings are beneficial to analyze the crack propagation at the interface during package-oriented reliability tests, and may therefore be employed to enhance these interfaces in microelectronic plastic packages.File in questo prodotto:
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Adhesion_Copper_Molding_Compound_Modeling_and_Characterization.pdf
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