Exploiting continuous scanning laser doppler vibrometry and wavelet processing for damage detection

The present paper proposes a novel damage detection approach based on the exploitation of the simultaneous time and spatial sampling provided by CSLDV and the feature extraction capabilities of wavelet-domain processing. Superficial defects are analysed in the paper. The damage detection procedure is presented and its performances studied in a simulated application on a plate with different crack scenarios (varying crack depth ratio). Both line and area scans are analysed, considering also the influence of measurement noise. The method shows promising results, since cracks are identified in all severity conditions. An example on a sub-surface defect on a carbon-fiber panel is also presented.