We present here results of the Quantum Technology Flagship project UNIQORN in the area of integrated photonics for quantum communication applications. Three distinct integration platforms, namely indium phosphide based monolithic integration, polymer-based hybrid integration and the CMOS-compatible silicon platform, have been employed to manufacture components and sub-systems on chip for quantum communication devices. The choice of different platforms was made to exploit the best characteristics of each platform for the intended quantum communication device. The indium phosphide platform was employed to manufacture a transmitter chip for quantum key distribution featuring laser, modulators, and attenuators. The transmitter chip was evaluated in a QKD experiment achieving a secure rate of 1 kbit/s. The polymer platform was investigated for engineering non-classical light sources. Entangled and heralded single-photon sources, based on non-linear optics, were assembled on the polymer in a hybrid fashion together with waveguides and other passive micro-optical elements. A quantum random number generator, featuring a 70% randomness extraction efficiency, was also fabricated using the polymer integration technique. An array of 32 individual single-photon avalanche diodes, operating at room temperature and featuring an onboard coincidence logic, was coupled to the chip to demonstrate direct detection of photons on the polymer. Finally, a transimpedance amplifier based on gallium arsenide high electron mobility transistors was produced with an exceptional large electrical noise clearance of 28 dB at 100 MHz.

On-Chip Quantum Communication Devices

Incoronato, Alfonso;Zanetto, Francesco;Zappa, Franco;Di Luch, Ilaria;
2022-01-01

Abstract

We present here results of the Quantum Technology Flagship project UNIQORN in the area of integrated photonics for quantum communication applications. Three distinct integration platforms, namely indium phosphide based monolithic integration, polymer-based hybrid integration and the CMOS-compatible silicon platform, have been employed to manufacture components and sub-systems on chip for quantum communication devices. The choice of different platforms was made to exploit the best characteristics of each platform for the intended quantum communication device. The indium phosphide platform was employed to manufacture a transmitter chip for quantum key distribution featuring laser, modulators, and attenuators. The transmitter chip was evaluated in a QKD experiment achieving a secure rate of 1 kbit/s. The polymer platform was investigated for engineering non-classical light sources. Entangled and heralded single-photon sources, based on non-linear optics, were assembled on the polymer in a hybrid fashion together with waveguides and other passive micro-optical elements. A quantum random number generator, featuring a 70% randomness extraction efficiency, was also fabricated using the polymer integration technique. An array of 32 individual single-photon avalanche diodes, operating at room temperature and featuring an onboard coincidence logic, was coupled to the chip to demonstrate direct detection of photons on the polymer. Finally, a transimpedance amplifier based on gallium arsenide high electron mobility transistors was produced with an exceptional large electrical noise clearance of 28 dB at 100 MHz.
2022
Photonic integrated circuits
Quantum communication
Quantum cryptography
Quantum entanglement
Quantum key distribution
Qubit
Random number generator
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/1231392
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