Thermal control is a key aspect of large-scale HPC centers, where a large number of computing elements is employed. Temperature is directly related to both reliability, as excessing heating of components leads to a shorter lifespan and increased fault probability, and power efficiency, since a large fragment of power is used in the cooling system itself. In this paper, we introduce the TEXTAROSSA approach to ther mal control, which couples innovative two-phase cooling with multi-level thermal control strategies able to address thermal issues at system and node level.

The TEXTAROSSA Approach to Thermal Control of Future HPC Systems

Fornaciari W.;Terraneo F.;Agosta G.;
2022-01-01

Abstract

Thermal control is a key aspect of large-scale HPC centers, where a large number of computing elements is employed. Temperature is directly related to both reliability, as excessing heating of components leads to a shorter lifespan and increased fault probability, and power efficiency, since a large fragment of power is used in the cooling system itself. In this paper, we introduce the TEXTAROSSA approach to ther mal control, which couples innovative two-phase cooling with multi-level thermal control strategies able to address thermal issues at system and node level.
2022
22nd International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation, SAMOS 2021
978-3-031-15073-9
978-3-031-15074-6
High Performance Computing, 2-phase cooling, Thermal modeling and control
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/1221466
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