Failures on MEMS microphones placed on dummy smartphone are observed during a guided free fall test. The instants before and after the first impact are registered with a high-speed camera and the displacement/velocity signals are used as input for three-dimensional finite element analyses at different scales to obtain insights at local level to judge whether possible ruptures arise. The numerical procedure follows a multi-scale, top-down approach and it can adopt both fluid-structure interaction and purely mechanical analyses. Finally, two loadings are transferred at the micro-scale to the thin silicon membrane representing the microphone: it is found that, in some drop cases, failures depend from the combination of the fluid-induced (air over-pressure) and of the solid-induced input (relative displacements at the anchors), and not from a single domain loading condition.
Top-down, multi-scale numerical simulation of MEMS microphones under guided free fall tests
Faraci, David;Ghisi, Aldo;Corigliano, Alberto
2021-01-01
Abstract
Failures on MEMS microphones placed on dummy smartphone are observed during a guided free fall test. The instants before and after the first impact are registered with a high-speed camera and the displacement/velocity signals are used as input for three-dimensional finite element analyses at different scales to obtain insights at local level to judge whether possible ruptures arise. The numerical procedure follows a multi-scale, top-down approach and it can adopt both fluid-structure interaction and purely mechanical analyses. Finally, two loadings are transferred at the micro-scale to the thin silicon membrane representing the microphone: it is found that, in some drop cases, failures depend from the combination of the fluid-induced (air over-pressure) and of the solid-induced input (relative displacements at the anchors), and not from a single domain loading condition.File | Dimensione | Formato | |
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DaAldoSiAlbe2021 - Microelectronics Reliability.pdf
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