An electromechanical micropolar peridynamic model

A micropolar peridynamic model for in-plane electro-mechanical behavior of isotropic solids is presented in this paper. The conceived analytical implicit formulation of the electrical part of the model is based on the definition of a proper microelectrical energy function and a specific bond electrical field measure. A compatibility condition and a constitutive relationship have been derived and thus the electrical stiffness operator has been obtained. The electrical formulation is then coupled with a mechanical micropolar peridynamic formulation with adjustable Poisson's ratio. The obtained unified model is capable to predict the elastic response and the electrical conduction of elastic brittle materials taking into account the influence of cracks and other defects. The accuracy of the proposed model has been assessed by several problems including the simulation of fracture propagation and damage sensing in a lamina under tensile loading and the piezoresistive response of nanocomposite materials.