A systematic and attentive comparison of the deuterium (D) retention in tungsten (W) coatings with different nano-crystalline structures after the plasma exposure in comparison with polycrystalline tungsten (PCW) is presented. While a wide database is available for PCW, only a few data about the D retention in coatings with different structures exist. The D retention in W coatings produced by three different deposition techniques on different substrates was studied with respect to the influence of (a) coating crystallite size, (b) coating thickness, (c) specimen temperature during D plasma exposure, (d) presence of argon (Ar) used as working gas during the coating deposition and (e) substrate material. It is shown that the variation of the processing parameters, such as temperature, deposition rate, Ar implantation, etc. even within one deposition method results in different grain size distributions and structure of coating and has a significant effect on the D retention. It is revealed that the substrate material and the presence of Ar in a coating play a minor role in the D retention in the coating. It is shown that both the D concentration and the D retention in coatings drastically increase with decreasing the grain size. Consequently, in the case of using of W coating as a protective layer of a structural material, a compromise in the development of nanostructured tungsten films is necessary to keep the hydrogen isotope concentration at an acceptable level.
Deuterium retention in dense and disordered nanostructured tungsten coatings
Dellasega, D.;Passoni, M.;
2018-01-01
Abstract
A systematic and attentive comparison of the deuterium (D) retention in tungsten (W) coatings with different nano-crystalline structures after the plasma exposure in comparison with polycrystalline tungsten (PCW) is presented. While a wide database is available for PCW, only a few data about the D retention in coatings with different structures exist. The D retention in W coatings produced by three different deposition techniques on different substrates was studied with respect to the influence of (a) coating crystallite size, (b) coating thickness, (c) specimen temperature during D plasma exposure, (d) presence of argon (Ar) used as working gas during the coating deposition and (e) substrate material. It is shown that the variation of the processing parameters, such as temperature, deposition rate, Ar implantation, etc. even within one deposition method results in different grain size distributions and structure of coating and has a significant effect on the D retention. It is revealed that the substrate material and the presence of Ar in a coating play a minor role in the D retention in the coating. It is shown that both the D concentration and the D retention in coatings drastically increase with decreasing the grain size. Consequently, in the case of using of W coating as a protective layer of a structural material, a compromise in the development of nanostructured tungsten films is necessary to keep the hydrogen isotope concentration at an acceptable level.File | Dimensione | Formato | |
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Ogorodnikova_JNM18_retention in PLDW.pdf
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