Ruthenium is electrodeposited for the first time from a deep eutectic solvent based electrolyte composed of ethylene glycol and choline chloride in 1:2 molar ration. Deposition is found to effectively occur upon addition of sulfamic acid to the Ru(III) containing deep eutectic solvent. Optimized plating conditions are able to yield uniform and crack-free coatings up to 800 nm thickness. No oxides or other notable secondary phases can be individuated in the obtained metallic layers.

Ruthenium electrodeposition from deep eutectic solvents

Bernasconi, R.;Magagnin, L.
2017-01-01

Abstract

Ruthenium is electrodeposited for the first time from a deep eutectic solvent based electrolyte composed of ethylene glycol and choline chloride in 1:2 molar ration. Deposition is found to effectively occur upon addition of sulfamic acid to the Ru(III) containing deep eutectic solvent. Optimized plating conditions are able to yield uniform and crack-free coatings up to 800 nm thickness. No oxides or other notable secondary phases can be individuated in the obtained metallic layers.
DES, ruthenium, plating
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/1063025
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