CACCHIONE, FABRIZIO
 Distribuzione geografica
Continente #
NA - Nord America 752
EU - Europa 284
AS - Asia 32
SA - Sud America 2
AF - Africa 1
OC - Oceania 1
Totale 1.072
Nazione #
US - Stati Uniti d'America 743
UA - Ucraina 68
AT - Austria 41
SE - Svezia 41
DE - Germania 34
GB - Regno Unito 30
IT - Italia 21
FI - Finlandia 19
SG - Singapore 15
BE - Belgio 13
CN - Cina 12
IE - Irlanda 11
CA - Canada 9
FR - Francia 4
BR - Brasile 2
NL - Olanda 2
VN - Vietnam 2
AU - Australia 1
CI - Costa d'Avorio 1
HK - Hong Kong 1
JP - Giappone 1
KR - Corea 1
Totale 1.072
Città #
Fairfield 97
Chandler 70
Ann Arbor 65
Woodbridge 64
Ashburn 55
Houston 54
Wilmington 51
Dearborn 43
Vienna 41
Jacksonville 38
Seattle 34
Cambridge 32
Boardman 14
Medford 14
Brussels 13
Lawrence 13
Dublin 10
Singapore 10
Ottawa 9
San Diego 7
Auburn Hills 5
Beijing 5
Helsinki 5
Los Angeles 3
Verona 3
Des Moines 2
Grafing 2
Hefei 2
Milan 2
Mountain View 2
Norwalk 2
Abidjan 1
Adelaide 1
Donabate 1
Falkenstein 1
Hong Kong 1
Jian 1
Lanzhou 1
London 1
Meerkerk 1
Miami 1
Nanchang 1
Pero 1
Redwood City 1
Shanghai 1
Washington 1
Xian 1
Totale 783
Nome #
Rupture tests on polysilicon films through on-chip electrostatic actuation 112
Out of plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach 100
Simulation of impact rupture in polysilicon MEMS 96
On-chip electrostatically actuated bending tests for the mechanical characterization of polysilicon at the microscale 93
Parametric study of fracture properties in polycrystalline MEMS 91
On-chip tests for the mechanical characterization of polysilicon at the microscale 72
Out of plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach 72
Micro-scale simulation of impact rupture in polysilicon MEMS 71
Material characterisation at the micro scale through on-chip tests 70
Rupture tests on polysilicon films through on-chip electrostatic actuation 69
Decoupled three-scale approach to MEMS failure, A 68
Out of plane vs. in plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach 68
Reliability analysis of MEMS sensors subject to drop impact 54
In-plane and out-of-plane mechanical characterization of thin polysilicon 46
Totale 1.082
Categoria #
all - tutte 3.107
article - articoli 1.001
book - libri 0
conference - conferenze 2.106
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 6.214


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/2020223 0 0 0 0 32 49 40 21 36 9 22 14
2020/2021155 16 7 17 5 30 5 15 17 6 20 11 6
2021/2022128 4 10 7 4 43 5 3 5 7 6 11 23
2022/2023156 13 2 3 20 19 35 0 13 30 4 10 7
2023/202449 3 13 3 6 7 12 3 0 0 1 0 1
2024/202534 5 2 9 1 17 0 0 0 0 0 0 0
Totale 1.082