CACCHIONE, FABRIZIO
 Distribuzione geografica
Continente #
NA - Nord America 734
EU - Europa 284
AS - Asia 15
SA - Sud America 2
AF - Africa 1
OC - Oceania 1
Totale 1.037
Nazione #
US - Stati Uniti d'America 725
UA - Ucraina 68
AT - Austria 41
SE - Svezia 41
DE - Germania 34
GB - Regno Unito 30
IT - Italia 21
FI - Finlandia 19
BE - Belgio 13
CN - Cina 11
IE - Irlanda 11
CA - Canada 9
FR - Francia 4
BR - Brasile 2
NL - Olanda 2
VN - Vietnam 2
AU - Australia 1
CI - Costa d'Avorio 1
JP - Giappone 1
KR - Corea 1
Totale 1.037
Città #
Fairfield 97
Chandler 70
Ann Arbor 65
Woodbridge 64
Houston 54
Ashburn 51
Wilmington 51
Dearborn 43
Vienna 41
Jacksonville 38
Seattle 34
Cambridge 32
Medford 14
Brussels 13
Lawrence 13
Dublin 10
Ottawa 9
San Diego 7
Auburn Hills 5
Beijing 5
Helsinki 5
Los Angeles 3
Verona 3
Des Moines 2
Grafing 2
Hefei 2
Milan 2
Mountain View 2
Norwalk 2
Abidjan 1
Adelaide 1
Donabate 1
Falkenstein 1
Jian 1
Lanzhou 1
London 1
Meerkerk 1
Miami 1
Nanchang 1
Pero 1
Redwood City 1
Washington 1
Xian 1
Totale 753
Nome #
Rupture tests on polysilicon films through on-chip electrostatic actuation 110
Out of plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach 98
Simulation of impact rupture in polysilicon MEMS 94
On-chip electrostatically actuated bending tests for the mechanical characterization of polysilicon at the microscale 91
Parametric study of fracture properties in polycrystalline MEMS 89
Out of plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach 70
On-chip tests for the mechanical characterization of polysilicon at the microscale 69
Micro-scale simulation of impact rupture in polysilicon MEMS 69
Material characterisation at the micro scale through on-chip tests 67
Rupture tests on polysilicon films through on-chip electrostatic actuation 67
Out of plane vs. in plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach 65
Decoupled three-scale approach to MEMS failure, A 62
Reliability analysis of MEMS sensors subject to drop impact 52
In-plane and out-of-plane mechanical characterization of thin polysilicon 44
Totale 1.047
Categoria #
all - tutte 2.544
article - articoli 840
book - libri 0
conference - conferenze 1.704
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 5.088


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2018/201964 0 0 0 0 0 0 0 0 0 0 35 29
2019/2020288 12 21 9 23 32 49 40 21 36 9 22 14
2020/2021155 16 7 17 5 30 5 15 17 6 20 11 6
2021/2022128 4 10 7 4 43 5 3 5 7 6 11 23
2022/2023156 13 2 3 20 19 35 0 13 30 4 10 7
2023/202448 3 13 3 6 7 12 3 0 0 1 0 0
Totale 1.047