In this paper, a domain decomposition approach is proposed to efficiently address the finite element simulation of fracture phenomena in polysilicon MEMS under impact dynamics. The analysis is performed at the microscale, i.e. at the level of the microstructural parts composing the microsystem, in order to simulate local failure mechanisms developing in critical regions.

A Domain Decomposition Method for the Simulation of Fracture in Polysilicon MEMS

CONFALONIERI, FEDERICA;COCCHETTI, GIUSEPPE;GHISI, ALDO FRANCESCO;CORIGLIANO, ALBERTO
2012-01-01

Abstract

In this paper, a domain decomposition approach is proposed to efficiently address the finite element simulation of fracture phenomena in polysilicon MEMS under impact dynamics. The analysis is performed at the microscale, i.e. at the level of the microstructural parts composing the microsystem, in order to simulate local failure mechanisms developing in critical regions.
2012
Proceedings of the IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
9781467315111
Domain Decomposition Methods; Fracture propagation; MEMS
File in questo prodotto:
File Dimensione Formato  
Confalonieri-Cocchetti-Ghisi-Corigliano-EuroSime2012-paper092.pdf

Accesso riservato

: Post-Print (DRAFT o Author’s Accepted Manuscript-AAM)
Dimensione 3.21 MB
Formato Adobe PDF
3.21 MB Adobe PDF   Visualizza/Apri

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11311/666987
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 1
  • ???jsp.display-item.citation.isi??? ND
social impact